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南京大学物理系陈坤基教授的一稿多投论文在Advanced Materials被撤回
 
作者：BOQ
 
在最新一期的材料顶级期刊Advanced Materials上，刊登了南京大学物理系陈坤
基教授等人的的撤稿。此事曾被网友“若智”在新语丝披露：“南京大学：这难
道还不算一稿多投？”(XYS20070616)。

Retraction
Self-Assembled Si Quantum-Ring Structures on a Si Substrate by Plasma-Enhanced Chemical Vapor Deposition Based on a Growth-Etching Competition Mechanism (p 2412) 
L. W. Yu, K. J. Chen, J. Song, J. Xu, W. Li, H. M. Li, M. Wang, X. F. Li, X. F. Huang 
Published Online: 10 Sep 2007 
DOI: 10.1002/adma.200790067 
http://www3.interscience.wiley.com/cgi-bin/abstract/116314595/ABSTRACT

撤稿信如下：
Retraction
Self-Assembled Si Quantum-Ring Structures on a Si Substrate by Plasma-Enhanced Chemical Vapor Deposition Based on a Growth-Etching Competition Mechanism**
By Lin Wei Yu, Kun Ji Chen*, Jie Song, Jun Xu, Wei Li, Hong Min Li, Mu Wang, Xue Fei Li,
and Xin Fan Huang

We submitted the above manuscript to Advanced Materials, which included the following content:
1) The growth of self-assembled Si quantum ring structures by a plasma-enhanced CVD method;
2) A growth-etching competition mechanism for the ring’s formation;
3) Observation of an ultra-long parallel Si nanowire structure from the evolution and impingement of neighboring Si rings;
4) The vertical electrical property of the Si ring structures measured by conductive AFM measurement.
We guarantee the authenticity and validity of the experimental data. 
However, content items 1) and 2) had already been included in another 
manuscript, submitted to Physical Review Letters, which was 
subsequently published (Phys. Rev. Lett., 2007, 98, 166102).We did not 
notify the editors of this fact. Based on this situation, we hereby 
issue a retraction of the above paper. The authors, with the 
exceptions of Hong Min Li and MuWang, apologize sincerely to the 
readers, referees and editors for violating the guidelines of ethical 
publication. We also apologize to our colleagues Hong Min Li and Mu 
Wang for mishandling of the manuscript.

Linwei Yu, Kunji Chen, Jie Song, Jun Xu, Wei Li, Xuefei Li, Xinfan Huang
Advanced Materials 2007, 19, 1577–1581.
DOI: 10.1002/adma.200602804

(XYS20070911)

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